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TCOOL​ Series Products Effective Thermal management solution for you

The work proficiency of elctronic componets will be seriously affected, if the generated heat cannot be emitted during operation, meanwhile, for miniaturization development directions in large scale intergrated circuit, the problem of heat disperation must be solved immediately. Shenzhen SinoGuide interface materials, as thermal management expert, provides effective thermal management solutions to reduce the thermal resistance, which is thermal interface manterials(TIMs), including gap pad, grease, phase change materials(PCM), thermal conductive adhesives, thermal encapsulation adhesives and insulator and so on. TCOOLTM series thermal products from low level to high level for customer to select.

Thermal Conductivity and Thermal Resistance

Thermal conductivity is inherent attribute of material, which is no change as determined components. It cannot directly indicate thermal ability in practical usage. Thermal resistance is related with thermal conductivity property and shape size of materials. From theoretical point of view, thermal resistance is proportional to the thickness, is inversely proportional to cooling area and thermal conductivity, In fact, thermal resistance can reflect more thermal ability.

In practical usage, theoretical formula cannot be directly used. Calculation formula of thermal resistance was recommended as to commonly adopt in Intra-industry.

Fourier’s Law:

Where the vector Q is the heat flux (W/m2) in the positive x-direction, dT/dx is the (negative) temperature gradient (K/m) in the direction of heat flow (i.e., conduction occurs in the direction of decreasing temperature and the minus sign confirms this thermodynamic axiom) and the proportionality constant K is the Thermal Conductivity of the material (W/m.K), and A represents the contact area.

Fourier's Law thus provides the definition of thermal conductivity and forms the basis of many methods of determining its value. Fourier's Law, as the basic rate equation of the conduction process, when combined with the principle of conservation of energy, also forms the basis for the analysis of most Conduction problems.