Thermal Interface Materials Experts and Supplier

Thermal Gap Filler provides 1.1W/mK of thermal conductivity

null@null.com (admin) — Tue, 05 Jun 2018 01:52:41 +0800

This Thermal Gap Filler provides 1.1W/mK of thermal conductivity that can conform to most surfaces. It’s perfect for high-value products that you need to keep cool, as it is a poor conductor of electricity while remaining a great conductor of heat! No additional adhesive is required when applying the Thermal Gap Filler, as it is naturally tacky and sticks to whatever you need it to — just be sure that’s where you need it!

Increasing the power density along with extended life-time expectation is an omnipresent demand in inverter designs. While chip manufacturers strive to increase the current carrying capabilities of silicon, inverter designers try to reduce the physical volume of the drive. Reduction of the heatsink‟s volume in combination with increased local power densities leads to higher demands on the thermal interface connecting power electronic components to the heat sink. This gap filler is both electrically insulating and stable from -40°C to 160°C and meets UL 94 VO rating.

Silicone-based thermal interface material that contains a high percentage of thermally conductive fillers.

Exhibit outstanding thermal performance and stability when filling the gap between the heat-generating device and its corresponding heatsink. Designed to dissipate heat and provide electrical insulation for power transistors, power modules, CPU’s, GPU’s, NorthBridge and other electrical components. Available in several different thicknesses, and various hardnesses, allowing the materials to be used in applications where the two mating surfaces of the assembly are either irregular or non-coplanar.

SinoGuide TCG Series Grease Gap Filler Dispensable Products

null@null.com (admin) — Wed, 02 Aug 2017 21:54:31 +0800

Thermal greases play an important role in managing the temperature of microprocessors in electronics. They have incredibly low contact resistances, and are able to completely fill any air gaps left between a processor and the heat removal system when they are applied. Furthermore, they are highly versatile, easy to apply, and reliable, making them an excellent tool for keeping electronics cool and operating efficiently. Temperature management is a crucial component in electronics design; as electronics become smaller and more powerful they also produce more heat in a smaller volume, which if not removed effectively will destroy reliability and significantly decrease product lifespan.

SinoGuide offers a variety of thermally conductive gap filler materials in many formats including silicone, non-silicone, pads, putty and dispensable. TCP series Gap Filler materials offer a range of thermal conductivities, hardnesses and thicknesses. Our line of TCG series Gap Filler materials have been designed to achieve desired thermal resistance between electrical components in today's advanced electronics designs.

TCG Series Gap Filler DISPENSABLE PRODUCTS

Silicone, Non-silicone and thermal grease products

Two-part dispensable products available

Thermal conductivity up to 5 W/mK

Ideal for applications where thin bond lines and conformability are desired

Low compression force required

Low stress on components during assembly

RoHS and HF Compliant

Good surface wetting

Conformable

Thermal Conductive Pad

null@null.com (admin) — Mon, 31 Jul 2017 05:09:43 +0800

Thermal Conductive Pad

Leading Thermal Pad, Grease & Thermal Glue Manufacturer in China

Thermal Conductive Pad is design to be used in the applications that require the minimum amount of pressure on components and high thermal conductivity. SinoGuide's Thermal conductive pad is very conformable, filled silicone rubber material and has 1-8W/mK based on hot disk thermal conductivity grades. It is easy to fill in air gaps between PC board and heat sinks or a metal chassis.

Our unique silicone chemistry ensures high compliance to surface irregularity and good surface wetting property, thus offering very low Thermal Contact Resistance at Thermal Joint, and very efficient heat transfer between hot spots and heat sink.

Our Thermal Gap Pad is highly tacky to most surfaces, so no PSA is required. Optionally, we offer one side non tacky to facilitate application that requires the easy removal of hot side component. Gap Pad is a thermally conductive material that acts as a thermal interface between a heat sink and an electronic device.

Thermal pad tcp500 is a fiberglass-reinforced filler and polymer featuring a high thermal conductivity. The material yields extremely soft characteristics while maintaining elasticity and conformability. The fiberglass reinforcement provides easy handling and converting, added electrical isolation and tear resistance. The inherent natural tack on both sides assists in application and allows the product to effectively fill air gaps, enhancing the overall thermal performance. The top side has reduced tack for ease of handling.

SinoGuide Technology Co.,Ltd established in 2007, is a world leading Chinese developer and manufacturer of products for Thermally Conductive Interface Materials(TIMs).

Customized solutions specifically designed to meet your design and application needs

10 Dedicated R&D scientists, research experts and engineers

Technical Field Support to assist with your thermal challenges

Strict process controls to guarantee the quality of your product

24 hrs Online Customer Service

Provide thermal solutions to the international leaders in EV battery applications

Partnered and supplying materials to industry leaders in Telecom market

Adding Sales and field support in all regions of the world

Plans to construct a 25000 sq. m. manufacturing and R&D facility Dongguan

Effective thermal management in electronic devices

null@null.com (admin) — Fri, 09 Jun 2017 05:22:52 +0800

Effective thermal management remains key to ensuring consistent long-term performance and reliability in electronic devices. With an increasing variety of electronic applications demanding smaller packaging, higher power, and lower cost, the need for innovative high-performance thermal solutions, designed for ease of automation, continues to grow. Because of these new challenges, The pad versions of thermal interface materials are becoming more and more prevalent throughout the electronic markets. These include lowering levels of thermal resistance over traditional methods, ease of automation, and the ability of reducing part count within the assembly. All of which can result in overall cost savings.

The pad thermal interface materials were originally designed for the automotive industry and the need for use highly automated production lines. These materials have been used for over a decade in some of the most demanding electronic products on the market. Because of their success there, the demand for thermal interface pad materials is rapidly rising in all of the electronic industry, as they assist in reducing the overall cost of manufacturing while increasing the thermal performance of assemblies.

the primary form of thermal interface materials used in the electronic industry has been a sheeted product or thermal interface pad. The ease of handling these product types, along with high dielectric integrity, have made thermal interface pad solutions a standard in managing heat in electronic modules for the last few decades.

TCOOL Series Products Effective Thermal management solution for you

null@null.com (admin) — Wed, 19 Apr 2017 21:00:50 +0800

The work proficiency of elctronic componets will be seriously affected, if the generated heat cannot be emitted during operation, meanwhile, for miniaturization development directions in large scale intergrated circuit, the problem of heat disperation must be solved immediately. Shenzhen SinoGuide interface materials, as thermal management expert, provides effective thermal management solutions to reduce the thermal resistance, which is thermal interface manterials(TIMs), including gap pad, grease, phase change materials(PCM), thermal conductive adhesives, thermal encapsulation adhesives and insulator and so on. TCOOL^TM series thermal products from low level to high level for customer to select.

Thermal Conductivity and Thermal Resistance

Thermal conductivity is inherent attribute of material, which is no change as determined components. It cannot directly indicate thermal ability in practical usage. Thermal resistance is related with thermal conductivity property and shape size of materials. From theoretical point of view, thermal resistance is proportional to the thickness, is inversely proportional to cooling area and thermal conductivity, In fact, thermal resistance can reflect more thermal ability.

In practical usage, theoretical formula cannot be directly used. Calculation formula of thermal resistance was recommended as to commonly adopt in Intra-industry.

Fourier’s Law:

Where the vector Q is the heat flux (W/m2) in the positive x-direction, dT/dx is the (negative) temperature gradient (K/m) in the direction of heat flow (i.e., conduction occurs in the direction of decreasing temperature and the minus sign confirms this thermodynamic axiom) and the proportionality constant K is the Thermal Conductivity of the material (W/m.K), and A represents the contact area.

Fourier's Law thus provides the definition of thermal conductivity and forms the basis of many methods of determining its value. Fourier's Law, as the basic rate equation of the conduction process, when combined with the principle of conservation of energy, also forms the basis for the analysis of most Conduction problems.

Cooling Silicone Pad - Thermal Pad

null@null.com (admin) — Thu, 23 Mar 2017 02:35:34 +0800

Product information

Cooling silicone pad can avoid the uneven application between the heatsinks and IC chips. Improve the effectiveness of your heatsink and reduce the operating temperature of your processor, video card, decreasing the chance of premature failure, also serves as electrical insulation and shock absorbers.

Features

conductive Silicon

This silicon cooling pad using a special material that makes it easy to deliver heat.

Easy Installation

The assembly is very easy that is by attaching a silicon CPU or GPU heatsink to you. Heat will be quickly transfer to the metal heatsink.

How to install:

1. Substitute thermal paste

2. Cut to cpu / chipset size

3. Put on cpu / chipset

4. Place the heatsink

Cooling Silicone Based Thermal Pad

Cooling Silicone Pad Application:

- High Temperature CPU / GPU / Chipset / Transistor

- Computer peripherals

- Mobile

- Portable electronic equipment

- Lamps and LED TV / LCD

- Equipment car / motorcycle

- Household appliances

- Electric Heaters

- And all the devices need to be filled gap for heat transfer

TCP600 Series Thermal Gap-pads New Release

null@null.com (admin) — Wed, 21 Dec 2016 19:52:33 +0800

Sinoguide Technology now release of the most thermally conductive interface materials on the market today by introducing three new types of premium thermal conductive pad. Based at Sinoguide Technology multi-year thermal management expertise,these three new types TCP600, TCP120, and TCP200 offer extremely high thermal conductivity without sacrificing compliancy or workability.

SinoGuide TCP600 is extremely soft, conformable, cost-effective and offers a thermal performance of 6 W/m-k.

Q: Can TCP600 series material be reworked?

A: With care TCP600 can be removed and repositioned without an appreciable loss in thermal performance.

Q: What is the shelf-life of the product?

A: Shelf-life for most gap-pads is one year. For thermal gap-pads with an adhesive the shelf life is six months from the date of manufacture. After these dates adhesive strength and inherent tack must be re-characterised.

Q: Will the pads soften with temperature?

A: Up to the maximum working temperature, as specified on the individual product datasheet, the materials will not suffer with temperature.

Q: Can TCP600 gap-pads supplied in different formats?

A: TCP600 can be supplied in sheet form, die-cuts or moulded parts.

Q: Does TCP600 gap-pads outgas?

A: TCP600 is formulated to exhibited low-outgassing and leakage of silicone oils. The weight loss is <1% when measured using ASTM E595.

Q: How does TCP600 gap-pads respond to ageing and thermal cycling tests?

A: TCP600 gap-pads does not exhibit any measurable changes in property when tested using all common industry standard environmental test regimes

Use TCP600 Thermal Pad For Test

Without the thermal pad, The temperature on the chip is at 70 celsius. If with the thermal pad TCP600, the temperature on the chip is decrease to 57 celsius.

So, this is what the function of our thermal pad to improve the thermal transfer from the chip to the outside, and that's why we expect to know your expectation of our thermal pad performance.

High End Thermal Pad with a 50.0 watt/mk Thermal Conductivity

null@null.com (admin) — Mon, 21 Nov 2016 03:02:28 +0800

The SinoGuide / mod/smart Ultra Extreme Thermal Pad is a ready to use high end thermal pad. These are custom cut to a smaller, more applicable size. This line of thermal pads are much more effective than stock pads. With a 50.0 watt/mk thermal conductivity these pads will pull heat away from your important components with ease and allow for overclocking as well! SinoGuide pads can be used for a wide variety of applications including laptops, gaming consoles, voltage regulators, memory ICs and much more.

Both sides have a protective plastic that can be peeled once ready to apply.

Carbon fiber filled. It has outstanding thermal conductivity. High material stability and suitable for extreme environment. It si used between heat sink and heat generating components, fill voids and rugged surfaces. This product has a very high thermal conductivity.

Features

Premium Quality

Easy to Use

Above Standard Thermal Conductivity

Easily Cut / Altered for All Applications

Notes

Please remove protective plastic from both sides prior to usage.

Thermal Pad/ Gap Pad Catalog - SinoGuide Technology

null@null.com (admin) — Mon, 21 Nov 2016 02:52:18 +0800

SinoGuide offers a wide variety of Thermal Gap Pad products that are highly conformable and offer excellent thermal conductivity. Bergquist innovative Gap Pads were developed to provide an effective thermal interface between heat sinks and electronic devices.

Request more information about SinoGuide Thermal Gap Pads http://www.sg-thermal.com/Thermal-Pad/

Find SinoGuide Technology Thermal Gap pad products

' - Thermal Pad Catalog, Gap Pad Products

SinoGuide Technology Gap Pad Features and Benefits

- Offers high thermal conductivity

- Elimination of air gaps to reduce thermal resistance

- Low stress vibration dampening

- Compatible with automated dispensing equipment

- Excellent conformability

- Low hardness

- Quick rebound to original shape

- Visco Elastic

SinoGuide Technology Gap Pad Typical Applications

- Telecommunications

- Computer and Peripherals

- Power Conversion

- Between heat-generating semiconductors or magnetic components with a heat sink

- Heat pipe assembly

SinoGuide Gap Pad Products

TCP20, 0.2 W/MK

TCP100, 1.0 W/MK

TCP110U, 1.1 W/MK

TCP150, 1.50 W/MK

TCP200, 2.0 W/MK

TCP300, 3.0 W/MK

TCP500, 5.0 W/MK

TCP600, 6.0 W/MK

TCP750 7.5 W/MK

AL20, 35 W/MK

AL50, 50 W/MK

' - SinoGuide innovative Gap Pads were developed to provide effective thermal interface between heat sinks and electronic devices

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Connect with SinoGuide

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https://www.facebook.com/sinoguide/

https://www.linkedin.com/company/sinoguide-technology-co.-ltd

https://twitter.com/PadThermal

https://plus.google.com/u/0/118435215593000343947

GPU CPU Heatsink Cooling Thermal Conductive Silicone Pad

null@null.com (admin) — Mon, 21 Nov 2016 02:41:21 +0800

SinoGuide Technology Co.,Ltd. was established in 2007, is a leading Chinese developer and manufacturer of products for Thermal Interface Materials(TIMs), for cooling your electronic devices.

SinoGuide Technology Co.,Ltd have developed a comprehensive range of choices for thermal interface materials which include thermal grease, thermally conductive gap pad, thermal conductive insulators and phase change materials, which satisfy the requirement of heat dissipation well in an extensive variety of applications, as well as widely applied to electromechanical, automotive, telecom and military industries.

Thermal Gap Filler Pad is design to be used in the applications that require the minimum amount of pressure on components and high thermal conductivity. SinoGuide Thermal Gap Filler Pad is very conformable, filled silicone rubber material and has 1.7-3.8 w/m-k conductivity grades; it is easy to fill in air gaps between PC board and heat sinks or a metal chassis.

SinoGuide Thermal Gap Filler Pad is naturally tacky, requiring no adhesive coating to inhabit thermal performance. It can also be with specific coating becoming single side tacky to allow easy material handling and installation.

gpu cpu heatsink cooling thermal conductive silicone pad

● High thermal conductivity

● Nature tacky or no sticky on carrier side

● RoHS Compliance

● 211 series offer high hardness for special application.

● 212 series offer low thermal contact resistance with various thermal conductivity

● 218 series offer ultra low stress at over 50% deflection.

● All products are available on fiber glass carrier with suffix F and single side tacky with suffix A

Thermal Pads Manufacturer in China