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Thermal Conductive Pad

Thermal Conductive Pad


Leading Thermal Pad, Grease & Thermal Glue Manufacturer in China


Thermal Conductive Pad is design to be used in the applications that require the minimum amount of pressure on components and high thermal conductivity. SinoGuide's Thermal conductive pad is very conformable, filled silicone rubber material and has 1-8W/mK based on hot disk thermal conductivity grades. It is easy to fill in air gaps between PC board and heat sinks or a metal chassis.


Our unique silicone chemistry ensures high compliance to surface irregularity and good surface wetting property, thus offering very low Thermal Contact Resistance at Thermal Joint, and very efficient heat transfer between hot spots and heat sink.


Our Thermal Gap Pad is highly tacky to most surfaces, so no PSA is required. Optionally, we offer one side non tacky to facilitate application that requires the easy removal of hot side component.



Thermal pad tcp500 is a fiberglass-reinforced filler and polymer featuring a high thermal conductivity. The material yields extremely soft characteristics while maintaining elasticity and conformability. The fiberglass reinforcement provides easy handling and converting, added electrical isolation and tear resistance. The inherent natural tack on both sides assists in application and allows the product to effectively fill air gaps, enhancing the overall thermal performance. The top side has reduced tack for ease of handling. 


SinoGuide Technology Co.,Ltd established in 2007, is a world leading Chinese developer and manufacturer of products for Thermally Conductive Interface Materials(TIMs).

Customized solutions specifically designed to meet your design and application needs

10 Dedicated R&D scientists, research experts and engineers 

Technical Field Support to assist with your thermal challenges

Strict process controls to guarantee the quality of your product

24 hrs Online Customer Service

Provide thermal solutions to the international leaders in EV battery applications

Partnered and supplying materials to industry leaders in Telecom market

Adding Sales and field support in all regions of the world

Plans to construct a 25000 sq. m. manufacturing and R&D facility Dongguan