Effective thermal management in electronic devices

Effective thermal management remains key to ensuring consistent long-term performance and reliability in electronic devices. With an increasing variety of electronic applications demanding smaller packaging, higher power, and lower cost, the need for innovative high-performance thermal solutions, designed for ease of automation, continues to grow.  Because of these new challenges, The pad versions of thermal interface materials are becoming more and more prevalent throughout the electronic markets.    These include lowering levels of thermal resistance over traditional methods, ease of automation, and the ability of reducing part count within the assembly.  All of which can result in overall cost savings. 

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