Thermal Conductive Pad

Thermal Conductive Pad


Thermal Conductive Pad is design to be used in the applications that require the minimum amount of pressure on components and high thermal conductivity. SinoGuide's Thermal conductive pad is very conformable, filled silicone rubber material and has 1-8W/mK based on hot disk thermal conductivity grades. It is easy to fill in air gaps between PC board and heat sinks or a metal chassis.

Effective thermal management in electronic devices

Effective thermal management remains key to ensuring consistent long-term performance and reliability in electronic devices. With an increasing variety of electronic applications demanding smaller packaging, higher power, and lower cost, the need for innovative high-performance thermal solutions, designed for ease of automation, continues to grow.  Because of these new challenges, The pad versions of thermal interface materials are becoming more and more prevalent throughout the electronic markets.    These include lowering levels of thermal resistance over traditional methods, ease of automation, and the ability of reducing part count within the assembly.  All of which can result in overall cost savings. 

TCOOL​ Series Products Effective Thermal management solution for you

The work proficiency of elctronic componets will be seriously affected, if the generated heat cannot be emitted during operation, meanwhile, for miniaturization development directions in large scale intergrated circuit, the problem of heat disperation must be solved immediately. Shenzhen SinoGuide interface materials, as thermal management expert, provides effective thermal management solutions to reduce the thermal resistance, which is thermal interface manterials(TIMs), including gap pad, grease, phase change materials(PCM), thermal conductive adhesives, thermal encapsulation adhesives and insulator and so on. TCOOLTM series thermal products from low level to high level for customer to select.

TCP600 Series Thermal Gap-pads New Release

Sinoguide Technology now release of the most thermally conductive interface materials on the market today by introducing three new types of premium thermal conductive pad. Based at Sinoguide Technology multi-year thermal management expertise,these three new types TCP600, TCP120, and TCP200 offer extremely high thermal conductivity without sacrificing compliancy or workability. 

High End Thermal Pad with a 50.0 watt/mk Thermal Conductivity

The SinoGuide / mod/smart Ultra Extreme Thermal Pad is a ready to use high end thermal pad. These are custom cut to a smaller, more applicable size. This line of thermal pads are much more effective than stock pads. With a 50.0 watt/mk thermal conductivity these pads will pull heat away from your important components with ease and allow for overclocking as well! SinoGuide pads can be used for a wide variety of applications including laptops, gaming consoles, voltage regulators, memory ICs and much more.

Thermal Pad/ Gap Pad Catalog - SinoGuide Technology

SinoGuide offers a wide variety of Thermal Gap Pad products that are highly conformable and offer excellent thermal conductivity. Bergquist innovative Gap Pads were developed to provide an effective thermal interface between heat sinks and electronic devices. 

GPU CPU Heatsink Cooling Thermal Conductive Silicone Pad

SinoGuide Technology Co.,Ltd. was established in 2007, is a leading Chinese developer and manufacturer of products for Thermal Interface Materials(TIMs), for cooling your electronic devices. 


SinoGuide Technology Co.,Ltd have developed a comprehensive range of choices for thermal interface materials which include thermal grease, thermally conductive gap pad, thermal conductive insulators and phase change materials, which satisfy the requirement of heat dissipation well in an extensive variety of applications, as well as widely applied to electromechanical, automotive, telecom and military industries. 

SinoGuide Thermal Pad Products Gallery

SinoGuide have developed a comprehensive range of choices for thermal interface materials which include thermal grease, thermally conductive gap filler, thermal conductive insulators and phase change materials, which satisfy the requirement of heat dissipation well in an extensive variety of applications, as well as widely applied to electromechanical, automotive, telecom and military industries.

Links to Suppliers of Thermal Management and Thermal Interface Materials Factory

Links to Suppliers of Thermal Management and Thermal Interface Materials Factory


Company Name                             Link                               

LIST OF EXHIBITORS of 2016 IEEE International Symposium on Electromagnetic Compatibility

Ottawa, ON Canada – The Shaw Centre

25th – 29th July 2016

The 2016 IEEE International Symposium on Electromagnetic Compatibility, sponsored by the IEEE EMC Society, featuring an embedded Signal Integrity and Power Integrity conference, is the must-attend event for EMC engineers of all levels and specialties.

The IEEE EMC Symposium provides knowledge and tools that help engineers address electromagnetic environmental effects and electromagnetic compatibility. Stay abreast of current technologies, testing and engineering methods.

Event Highlights

• Keynote Speaker
• Embedded SIPI Conference
• Special Focus on Military EMC
• Aerospace EMC Special Session
• Ask the Experts
• Panel Discussions

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