SinoGuideTM TCP100 Series Thermal Pad Compare with Bergquist Gap Pad® HC1000
Highly Conformable, Thermally Conductive Material for Filling Air Gaps
“Gel-Like” Modulus Gap Filling Material
Typical Properties of TCP100 and Gap Pad® HC1000 Materials | ||||
Properties | TCP100 Series | Gap Pad® HC1000 | Test Method | |
Reinforcement Carrier | - | Fiberglass | — | |
Color | Dark Blue | Gray | — | |
Density (g/cc) | 2.2 | 1.6 | ASTM D792 | |
Thickness(mm) | 0.5 to 4.0 | 0.254 to 0.508 | ASTM D374 | |
Hardness(Shore C) | 25 | 25 | ASTM D2240 | |
Tensile strength(KN/m) | 0.75 | 0.75 | ASTM D412 | |
Operation Temperature(℃) | -40 to 150 | -60 to 200 | EN334 | |
Breakdown Voltage(K.v) | >7 | >5 | ASTM 149 | |
Volume Impedance(Ω.cm) | 1.0×1011 | 1.0×1011 | ASTM D257 | |
Dielectric constant(@|MHz) | 4.87 | 5.5 | ASTM D150 | |
Thermal conductivity(W/m.k) | 1.0 | 1.0 | ASTM D5470 | |
Flame Rating | V-0 | V-0 | UL94 | |
Price | Cheap | Expensive | - | |
Both the materials are extremely conformable, low-modulus polymer that acts as a thermal interface and electrical insulator between electronic components and heat sinks.The
“gel-like” modulus allows this material to fill air gaps to enhance the thermal performance of electronic systems. This type of material offered with removable protective liners on both sides of the material.
TCP100 and Gap Pad® HC1000 Typical Applications Include:
• Computer and peripherals
• Telecommunications
• Heat interfaces to frames, chassis, or other heat spreading devices
• RDRAM™ memory modules / chip scale packages
• CDROM / DVD cooling
• Areas where irregular surfaces need to make a thermal interface to a heat sink
• DDR SDRAM memory modules
• FBDIMM modules
