New introduced specially formulated thermal interface pad materials

SinoGuide Technology has introduced specially formulated thermal interface pad materials that simplify board-level maintenance by reducing material tearing during disassembly for re-work and repair. TCP and TC series thermal interface materials feature a unique hardened top surface. This one-sided surface treatment is less tacky than the opposing contact side, allowing the thermal pad material to consistently adhere to either the electrical component or opposing heat sink. The hard surface releases quickly and easily from its component without tearing or damage. TCP and TCI series thermal pad materials are available in seven different formulations and offer thermal conductivity from 1.0 to 7.5 W/m.K.

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Laird Tech

Laird Technologies designs and manufactures customized, performance-critical products for wireless and other advanced electronics applications. The company is a global market leader in the design and supply of electromagnetic interference (EMI) shielding, thermal management products, signal integrity components, antenna solutions, as well as radio frequency (RF) modules and wireless remote controls and systems.

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