The UTP100 Series Thermal Conductive Pad

The UTP100 series thermal conductive pad is made through advanced artificial handling with fiberglass reinforced,which is composed of silicone polymer with ceramic fillers backed thermal conductive pad. The UTP100 is a ultra-soft and exceptional compressive material.It offers excellent thermal performance in close contact with electronic components for effectively lowering the interface thermal resistance. It has natural inherent tack on one side,and works stably at ambient temperature during -40-150 celcius with meeting the requirement of UL94V-0 class.

SinoGuide TCP100U Series Thermal Pad Compare with Bergquist GAP PAD VO Soft

SinoGuide TCP100U Series Thermal Pad Compare with Bergquist Gap Pad® VO Ultra Soft

Highly Conformable, Thermally Conductive Material for Filling Air Gaps

 

Typical Properties of TCP100U and GAP PAD VO ULTRA SOFT Materials

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