[Hot] Thermal Interface Materials Providers Over The World

Thermal Pad used Between IC and Heatsink

When we talk about thermal pad, we will know that it's a pre-formed square or rectangle of solid material typically used with a central processing unit (CPU) and heatsink to create a better system of thermal conductivity.

Pad type of thermal material is often used instead of thermal paste since it is less messy than the paste and is sometimes included with a newly purchased heatsink rather than thermal paste. The thermal pad is typically less effective than thermal paste, however, so any computer user looking to overclock his or her CPU should consider using the paste rather than a pad.

Materials for Heat Transfer Application Examples

A leading electronics services provider based in the China, SinoGuide, a developer of silicon-based technology, has introduced new SinoGuide dispensable thermal pads for use in LED, data server, telecommunications equipment and transportation thermal management applications.

SinoGuide TP100 Compare with Bergquist Gap Pad® HC1000

SinoGuideTM TCP100 Series Thermal Pad Compare with Bergquist Gap Pad® HC1000

Highly Conformable, Thermally Conductive Material for Filling Air Gaps

“Gel-Like” Modulus Gap Filling Material

SinoGuide TCP100U Series Thermal Pad Compare with Bergquist GAP PAD VO Soft

SinoGuide TCP100U Series Thermal Pad Compare with Bergquist Gap Pad® VO Ultra Soft

Highly Conformable, Thermally Conductive Material for Filling Air Gaps

 

Typical Properties of TCP100U and GAP PAD VO ULTRA SOFT Materials

TCP080 Series Thermal Pad Compare with The Bergquist Company GAP PAD VO

 

SinoGuide TCP080 Series Thermal Pad Compare with The Bergquist Company  GAP PAD VO

Conformable, Thermally Conductive Material for Filling Air Gaps

SinoGuide Thermal thermal materials

 

SinoGuide Thermal thermal materials deliver engineers and designers the most dimensional tolerance by conforming to surface irregularities and replacing air with a much higher thermal conductivity interface material; increasing the heat transfer and allowing the component to run cooler. Extreme compliancy reduces component stress while higher thermal conductivity provides thermal performance required for next generation designs that continue to pack more power into smaller spaces. The thermal materials like thermal pad for SinoGuide Thermal is used in many applications such as notebook computers, mass storage devices, and audio and video components.

Thermal pad used in multiple heat sources with a single heat sink

 Multiple heat sources with a single heat sink

More and more designer cooling multiple heat sources with a single heat sink, but it can create critical design issues, and it may not be recommended. However, there are cases where this design approach is advantageous, so the following design considerations should be taken into account.

Silicone Rubber Thermal Pads

Sinoguide Thermal owns excellent technology and equipment which could change macromolecules polymer to meet specific temperature extreme test and applied with other possible chemicals, long time, and reliability test, and product is outgassing-free.

SinoGuide Thermal is a professional thermal pad factory

SinoGuide Technology is a professional thermal pad factory, advanced equipment, exquisite technology, rich experience, the standardized management of large-scale enterprise. To help you enhance the enterprise / product added value; help you to achieve a greater platform.

SinoGuide Technologies offers a line of thermally conductive electrically insulating materials

 

SinoGuide Technologies offers a line of thermally conductive electrically insulating materials that are designed to solve over-heating issues for today's power component assemblies.

The robust TC Series 900s, 1200, 2000, TCK4, TCK6, TCK10 product line is a film-based material that is designed to resist cut-through in screw mounting applications. TC Series 900s products provide a more consistent breakdown voltage over other insulation constructions with soft conformal coating on the film core that provides an excellent mating surface for low pressure clip mounting applications.

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